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Growth Opportunities in AI Edge Inference chips, Wearables, Neural Processing Units, Plastic Processors, GeSi Technology: Including Small Footprint Lightweight Devices, Smart Monitoring and More -

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Press release content from Business Wire. The AP news staff was not involved in its creation.
December 20, 2022 GMT

DUBLIN--(BUSINESS WIRE)--Dec 20, 2022--

The “Growth Opportunities in AI Edge Inference chips, Wearables, Neural Processing Units, Plastic Processors, GeSi Technology” report has been added to’s offering.

The Microelectronics Technology Opportunity Engine captures innovations related to wearable electronic skin, AI chips, neural processing units, GeSi technology, plastic processors, and NAND SSDs.

The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables.

Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).


Key Topics Covered:

1. Innovations in Microelectronics

  • Wearable Electronic Skin Enables Heartbeat Monitoring
  • Value Proposition of MIT’s Electronic Skin
  • AI Edge Inference Chip Carries Out High-speed Computing
  • Value Proposition - FuriosaAI
  • FuriosaAI - Investor Dashboard
  • Neural Processing Unit Delivers High Efficiency in Edge Computing Applications
  • Value Proposition - DeepX
  • DeepX - Investor Dashboard
  • Wearable Monitors’ Breathing Patterns to Carry Out Stress Management
  • Value Proposition - IBreve
  • Strongarm Technologies - Investor Dashboard
  • AI SoC Aids in High-efficiency Image Recognition for Smart Transportation
  • Axera’s Value Proposition
  • Axera - Investor Dashboard
  • GeSi Technology for Spectral Sensing Applications
  • Artilux’s Value Proposition
  • Artilux - Investor Dashboard
  • Buck Converter IC for Portable Electronic Applications
  • Silanna’s Value Proposition
  • Silanna - Investor Dashboard
  • Plastic Processors for Flexible Electronic Applications
  • University of Illinois Urbana-Champaign’s Value Proposition
  • Wi-Fi 6 Integrated Circuit (IC) for IoT Applications
  • Nordic Semiconductor - Value Proposition
  • Nordic Semiconductor - Investor Dashboard
  • Vertical NAND Solid State Drives (SSDs) for Personal Computers
  • Samsung Semiconductor - Value Proposition
  • Samsung Semiconductor - Investor Dashboard
  • High Bandwidth Memory (HBM) DRAM Technology for Data Centers
  • SK Hynix - Value Proposition
  • SK Hynix - Investor Dashboard
  • Bidirectional Charging Infrastructure for Electric Vehicles (EVs)
  • Rhombus Energy Solutions - Value Proposition
  • Rhombus Energy Solutions - Investor Dashboard
  • Wearable Heart Monitor Tracks Active Patients
  • Value Proposition of Qardio
  • Qardio - Investor Dashboard
  • Smart Goggles Help Coach Swimmers
  • Value Proposition of Form Athletica
  • Form Athletica - Investor Dashboard
  • Key Contacts


2. Appendix

  • Criteria for Rating of Innovations--Explanation

Companies Mentioned

  • Artilux
  • Axera
  • DeepX
  • FuriosaAI
  • GeSi Technolog
  • IBreve
  • Nordic Semiconductor
  • Qardio
  • Rhombus Energy Solutions
  • Samsung
  • Silanna
  • SK Hynix

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SOURCE: Research and Markets

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PUB: 12/20/2022 03:08 PM/DISC: 12/20/2022 03:07 PM